2024-2025techQ1 · 2024
Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.
Multi-laser LPBF (up to 12 lasers) and larger build volumes are shifting the economics of metal AM production. Binder jetting scale-up at HP, Desktop Metal, and ExOne is testing whether sintering economics can match LPBF quality at volume.
presenthigh confidence · 82/100
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Cite this page
APA
AM Roadmap. (2024). Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.. AM Roadmap (v0.4.2-fixes-deployed). Retrieved 2026-05-17, from https://amroadmap.com/timeline/present-2024-2025-hardware-3
BibTeX
@misc{amroadmap_multi_laser_lpbf_larger_build_envelopes__2024,
title = {Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.},
author = {{AM Roadmap}},
year = {2024},
url = {https://amroadmap.com/timeline/present-2024-2025-hardware-3},
note = {AM Roadmap dataset v0.4.2-fixes-deployed, accessed 2026-05-17}
}Canonical URL: https://amroadmap.com/timeline/present-2024-2025-hardware-3